Igor’s Lab has some new information on AMD’s forthcoming EPYC (codename Milan) processors. The site claims that fresh server chips are slated to replace the EPYC 7002-series (codename Rome) later this year.
We already know from AMD’s official disclosures that Milan, which probably adopts the EPYC 7003-series moniker, will undoubtedly debut with AMD’s next-generation Zen 3 microarchitecture. Predictably, AMD will continue to tap TSMC’s manufacturing abilities for Milan. Word around town is that the third-generation EPYC processors would benefit from the foundry’s improved 7nm+ process node, but both the foundry and AMD have changed the name of the 7nm+ node on their respective roadmaps, so that remains up for debate.
According to the leak, despite being on a new microarchitecture, Milan will slot fine into the existing Socket SP3. However, Milan is the last wave of EPYC parts to grace the socket as its successor (codename Genoa) is expected to usher in the new Socket SP5. In regards to the primary leaked specifications, Milan shouldn’t deviate much from Rome. The Zen 3 processors still max out at 64 cores, come with support for eight DDR4 memory channels, DDR4-3200 modules and high-speed PCIe 4.0 lanes.
The specifications from Igor’s report are for the A0 stepping silicon, meaning these are early engineering samples. While we don’t expect the core or thread count to differ, the clock speeds will likely improve with the final silicon. As with any leak, there’s also the possibility the information is incorrect, but the details largely line up with our expectations for the EPYC Milan chips.
|Design||8 x 1 x 8||8 x 1 x 8||4 x 1 x 8|
|Cores / Threads||64 / 128||64 / 128||32 / 64|
|Boost Clock (GHz)||2.2||3.0||3.0|
|L1 Cache (MB)||2||2||1|
|L2 Cache (MB)||32||32||16|
|L3 Cache (MB)||256||256||128|
|TDP / Max TDP (W)||225 / 240||225 / 240||180 / 200|
*Specifications are unconfirmed.