Almost four years ago is when we first caught wind of AMD’s ambitious Exascale Heterogeneous Processor (EHP). The concept was simple: it would combine a resounding 32 cores with Greenland graphics and HBM memory onboard. Fast forward 4 years, AMD has easily delivered on its 32-core dream but an APU of that scale remains elusive. If you thought the company had given up work on its EHP ambitions, here is some great news for you: they haven’t.
AMD’s Exascale Heterogeneous Processor (EHP) will feature X3D packaging, dynamic memory management, heterogeneous deep learning architecture and more
Twitter user Underfox discovered a treasure trove of patents indicating that AMD’s EHP project is very much alive and kicking. In fact, the packaging that would allow the EHP to be constructed, namely X3D, was also demoed in a recent presentation on March 5, 2020. While most of the patents are highly technical there are some very interesting tidbits in there including one for dynamic memory management. AMD has already introduced a plethora of smart shifting (pun intended) technologies to handle constrained thermal and power envelopes in SoCs and dynamic memory management is something that would be a logical continuation of this optimization philosophy.
Patent: Dynamic memory management on a graphics processing unit – AMD
This is HUGE step in the development of AMD’s new generation of GPUs… This is one of the foundations for EHP.
— Underfox (@Underfox3) April 6, 2020
While AMD has rolled out CPUs with massive core counts all the way up to 64 cores using their MCM philosophy, they have yet to do the same with a GPU. A chip that combines an MCM CPU with an MCM GPU (plus HBM) onboard a single X3D package will be an immensely useful chip that could well go on in the exascale data centers of tomorrow. While there is currently no supercomputing cluster that is…